High Speed Wireless IC Design |
We have a unique blend of systems know-how as well as IC design capability. We focus on the system design aspect of any mobile communications system, and an in-depth competitive analysis, before defining new chip-sets, and embarking on the IC design task. That has been the key reason for the success of our integrated circuits. Our IC design ability has also allowed us to be very smart users of existing chips in our system design. We are specialized in RF IC design with proven ability to design innovative circuits resulting in numerous patents. Our expertise range from DECT, GSM, DAMPS to 3G Mobil Spread-Spectrum Wireless LAN Transceiver ICs. The RF IC’s designed by Entiv (Unistar) have been used by many manufacturers of mobile handsets, and personal communications products. For digital IC design, we prove your system concept and implement a circuit on an FPGA before doing a full ASIC.
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Capabilities: - Full IC design capability.
- Very powerful in-house developed CAD automation software.
- Advanced BiCMOS layout capability.
- Initial characterization.
- Instant link for electronic transfer of circuits, IC layout, PCB layout and documentation.
- Communications systems architecture and protocol analysis.
- Design and analysis of RF, baseband mixed-mode, and other DSP integrated circuits.
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The type of ICs we can design: Our biggest strength is in low power, low voltage Transmitter, Receiver, Modulator/Demod, and Synthesizer circuits. Carrier/clock recovery circuits, continuous time filters are also areas in which we have experience and expertise. We can analyze the full architecture of your existing solutions, and help you in the design and definition of new higher integration solutions for cost reduction, and high performance. We can design Analog CMOS, A/D, and D/A's, and switched-capacitor and digital filters for advanced CODEC applications. We can prove your digital design concept with FPGA's then we proceed with a full VLSI ASIC design.
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Previous Projects: - Design of GSM IF ICs (Low distortion transmitters, Advanced quadrature signal generation)
- Design of several of the best known FM/IF ICs
- 1 volt RF CMOS building blocks for pagers
- GPS RF to baseband IC in CMOS technology
- GPS Base-band digital IC design (100k gates) for human scale movements
- Smart card CPU and dedicated co-processor design
- 400 MHz GSM IF Chip. The design of transmitter, LO buffers, Level-locked-loop, on chip reference, and logic interface in BiCMOS technology resulted in 6 patents.
- 110MHz/9.8MHz IF chip with an integrated switch for DECT which resulted in 2 patents.
- 240MHz/10.7MHz receiver chip for DECT
- 90MHz/500KHz IF chip for digital cellular telephony.
- 240MHz/10.7MHz FM IF. The first low voltage high frequency FM IF with extended RSSI, and fully internal filter matching.
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More than 20 patents filed on: - Extended RSSI
- New Mixer
- Positive feedback IF limiters
- High-Speed High-Slew Rate
- Buffer/Switch
- Level Locked Loop
- Oscillation-free prescaler
- Symmetric phase detector
- Loop back testing
- High speed DC shifter
- High frequency current source
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What is a typical IC design cycle for us? - We work on the specification and feasibility, and finalize them with you. For major projects we can come to your site.
- If your IC process is not well characterized we will assit you in testing and key parameter extraction.
- We design circuit blocks and report updates of the work in progress to you.
- We will then come up with a full design review (faxed in full and also sent by internet in encrypted format).
- The design review package includes numerous vs. Vcc, Temp and process, and full layout package (matching, floorplan and critical paths). The simulations always include package parasitics in full.
- Layout can be done at our site if full process information is available. We will upload the GDS-II file to your system.
- If you decide to do the layout, we can provide a Spice netlist for LVS.
- During the layout we continue with process variation simulations if needed.
- We also provide test PCB (Protel software with Gerber output) before the wafer is back, so you will have a chance to have the evaluation PC board ready when the packaged die is available.
- We also provide automatic tester documentation to help the test engineer write the test software.
- Our reports are all dated with clear page numbers, clearly written, well documented and organized for future reference.
- After the IC is processed, initial characterization can be done at our site for certain circuits. If the circuit requires highly specialized testers we will provide assistance remotely, or just show up locally to do the job.
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© 1985-2010 Entiv Data Systems, Inc ™, All Rights Reserved.
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